MANUFACTURER OF : PLASTIC ELECTRONIC COMPONENTS
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MANUFACTURING FACILITIES

Moulding Facilities:

S.No. Description Qty
1 Joy 30 02
2 ST-50 05
3 SP-80 05
4 GEK-60/B1 05
5 GEK-80/B1 07
6 SM-90 01
7 SM-90(THERMOSET) 01
8 SM-100 03
9 SM-120 02
10 ASIAN PLASTIC-120(THERMOSET) 01
11 SM-150 01
12 GEK-180/B1 02
13 GEK-250 03
14 GEK-280 02
15 GEK-350 01
16 SM-350 01
17 GEK-720 01
18 STRETCH BLOW MOULDING MACHINES 13
19 ASB NISSEI(50MB) 01
20 ASB NISSEI(70DPH) 01

Future Plan
SM-450,SM-530, ASB NISSIE(50MB)-04 NOS, 70DPH-03 M/C, IN THE END OF FINACIAL YEAR 08-09.

Product Design
The latest technologies for product designing have been adopted, which include
• Auto cad R2004 & R2006
• I-deas 9
• Pro-E WILD FIRE
• CATIA V5 R13
• UNIGRAPHICS NX-3
This has resulted in a substantial reduction in design to delivery time. In excess of 100 new products are developed each year.

Production Engineering
Dedicated teams of engineers oversee the development of manufacturing infrastructure for new products and documentation for all the processes. Techniques of JIT, Single Piece Flow, SMED and POKA-YOKE ensure optimum utilization of resources and speedy